• RecordNumber
    18742
  • LC Class
    TK
  • LC Number
    7874
  • LC CutterNumber
    .M53
  • Dewey Class
    621
  • Dewey Number
    .381
  • Dewey Date
    /046
  • Title

    Microelectronic packaging technology

  • Author Statement
    edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
  • Publication
    ASM International
  • Publication Year
    c1989
  • Collation
    xii, 479 p.: ill.; 29 cm
  • Notes
    "SAN 204-7586"--T.p. verso
  • Subject

    Microelectronic packaging- Congresses

  • ADDED ENTRIES
    Shieh, Wei T,ASM International. Electronic Materials and Processing Division,Title: Micro electronic packaging technology
  • Holding Info.
    0871703599
  • DocumentNumber
    32582
  • SubTitle
    : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
  • Title2
    Cover title: Micro electronic packaging technology
  • Biblography
    Includes bibliographies
  • BL
    BL
    • Link To Document
    https://library.iut.ac.ir/dl/search/default.aspx?Term=18742&Field=0&DTC=100