Title :
Polymeric materials for electronics packaging and interconnection
Author Statement :
John H. Lupinski, editor, Robert S. Moore, editor
Publication :
American Chemical Society
Collation :
xi, 499 p.: ill.; 24 cm
Series :
ACS symposium series ; 407
Notes :
"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
Subject :
Electronic packaging- Materials- Congresses,Polymers- Congresses
ADDED ENTRIES :
Lupinski, John H., 1927-
Holding Info. :
0841216797
Biblography :
Includes bibliographical references
