Author :
Madenci, Erdogan
Title :
Fatigue life prediction of solder joints in electronic packages with ANSYS
Author Statement :
Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
Publication :
Kluwer Academic Publishers
Collation :
xx, 185 p. ill. 25 cm. +1 CD-ROM
Series :
Kluwer international series in engineering and computer science
Subject :
Electronic packaging , Solder and soldering , Metals , Service life (Engineering) , ANSYS (Computer system)
ADDED ENTRIES :
Guven, Ibrahim , Kilic, Bahattin ,
تاريخ ورود اطلاعات :
87/11
Index :
Includes bibliographical references and index
