Title :
Fracture mechanics and technology
Author Statement :
editors, G. C. Sih, C. L. Chow
Publication :
Sijthoff and Noordhoff International Publishers
Collation :
2 v. : ill. ; 25 cm
Notes :
Sponsored by Lehigh University, Bethlehem, Pa. and the University of Hong Kong, Hongkong
Subject :
Fracture mechanics -- Congresses
ADDED ENTRIES :
Sih, G. C. (George C.),Chow, C. L,Lehigh University,Hongkong. University
Holding Info. :
9028606378
SubTitle :
: proceedings of an international conference on fracture mechanics and technology, held at the Convention Centre, Hong Kong, March 21-25, 1977
Biblography :
Includes bibliographical references.
