Title :
Microelectronic packaging technology
Author Statement :
edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
Publication :
ASM International
Collation :
xii, 479 p.: ill.; 29 cm
Notes :
"SAN 204-7586"--T.p. verso
Subject :
Microelectronic packaging- Congresses
ADDED ENTRIES :
Shieh, Wei T,ASM International. Electronic Materials and Processing Division,Title: Micro electronic packaging technology
Holding Info. :
0871703599
SubTitle :
: materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
Title2 :
Cover title: Micro electronic packaging technology
Biblography :
Includes bibliographies
