پديد آورنده :
حسيني، ميلاد
عنوان :
ساخت و مشخصه يابي لحيم بدون سرب نانوكامپوزيتي قلع - مس به روش نورد تجمعي
مقطع تحصيلي :
كارشناسي ارشد
گرايش تحصيلي :
شناسايي و انتخاب مواد
محل تحصيل :
اصفهان : دانشگاه صنعتي اصفهان
صفحه شمار :
[يازده]، 65ص، : مصور (رنگي)، جدول، نمودار
استاد راهنما :
بهزاد نيرومند، علي مالكي
توصيفگر ها :
لحيم بدون سرب , آلياژ قلع-مس , نانو كامپوزيت , ريزساختار , خواص مكانيكي , نورد تجمعي , ذوب مجدد
استاد داور :
علي اشرفي، عباس قائي
تاريخ ورود اطلاعات :
1398/07/15
رشته تحصيلي :
مهندسي مواد
تاريخ ويرايش اطلاعات :
1398/07/15
چكيده انگليسي :
Degree Masters Title Synthesis and characterization of Sn Cu lead free nanocomposite solder by Accumulative Roll Bonding process Author Milad Hosseini Supervisor B Niroumand A Maleki Department Materials Engineering Date June 19 2019AbstractSoldering involves connecting at least two metal pieces by melting and solidifying a low meltingpoint alloy between them where the connection is made through diffusion As the number ofelectronic products and the ensuing solder usage is increasing the durability of solder is becomingone of the key factors controlling life time of electronic devices For decades Sn Pb alloys were thebest available solders with unique combination of mechanical physical chemical and electricalproperties In the current century however human health and environmental issues have resulted ina ban on use of tin lead solders Sn Cu alloys are among the most promising alternative solder alloysconsisting of tin rich phases Sn Cu eutectic structure and Cu6Sn5 interphase phases These solderalloys are characterized by low melting temperature and low mechanical properties Reinforcing thesolder with nano ceramic particles can be used to improve their mechanical properties However very limited work have been done in this regard so far In this study a Sn 0 7wt Cu alloy was firstmade by vacuum melting of the corresponding pure metals and the success in alloying was confirmedby microstructural and differential scanning calorimetry studies In the next step lead free Sn 0 7wt Cu 1wt SiO2 nanocomposite was made by accumulative rolling bonding ARB method The results showed that performing six passes of ARB applying 75 percent reduction of cross sectional area per pass without using lubricant or surface preparation operation resulted in optimaldistribution of nanoparticles in the matrix alloy Under such conditions an increase of 130 and260 in microhardness and ultimate strength of the optimal nanocomposite specimen were obtainedcompared to the original tin copper sheet respectively It was also observed that with increasing thenumber of ARB passes the strength of the sample was reduced due to formation of edge cracks andembrittlement of the samples To investigate the solder performance under service conditions microstructure and mechanical properties of the solder were also investigated after reflow Theresults showed 20 increase in shear strength as well as refinement of the microstructure of thereflowed optimal composite specimen as compared to the initial tin copper sheet The resultsdemonstrated that ARB process resulted in rather uniform distribution of nanoparticles in the matrixalloy Consequently the nanoparticles could act as potential nucleation sites after reflow and improvethe microstructure and mechanical properties of the solder Key words lead free solder Sn Cu alloy Nanocomposite Microstructure Mechanical Properties Accumulated Roll Bonding Reflow
استاد راهنما :
بهزاد نيرومند، علي مالكي
استاد داور :
علي اشرفي، عباس قائي
